It is recommended, therefore, that this specifications not be specified for new designs. The Aerospace Materials Division, however, does not recommend these specifications for future use in new designs. Similar but not necessarily identical processes are covered in the following specifications. AMS-CB is therefore reinstated and is designated as a noncurrent document. The use of this report is entirely voluntary, and its applicability and suitability for any particular use, including any patent infringement arising therefrom, is the sole responsibility of the user. SAE invites your written comments and suggestions.
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The class of an electroless nickel plating refers to the post-plating heat treatment process that is used; the grade of an electroless nickel plating refers to its thickness. Class Heat Treating Heat treatment after electroless nickel plating provides evidence of proper adhesion and improves the crystalline structure of the amorphous deposit for greater hardness.
Six heat-treat classes are available. Class 1 is for electroless nickel coatings that require no heat treatment. Classes 2 through 5 exist at various levels between these two extremes. Grade A requires a minimum thickness of 0. Service condition is based on the thickness, starting with SC0 for minimum service requirements and continuing up to SC4 for severe-service requirements.
ASTM B also specifies five 5 types of electroless nickel plating. The chemical solution used for these coatings must be monitored for pH, temperature, nickel concentration, and hypophosphate concentration, among other factors.
At ENS Technology, we test our electroless nickel plating solution at least once per hour to maintain optimum nickel and hypophosphate concentration. Additionally, we mechanically agitate our plating solution to improve coating smoothness and prevent pitting, streaking, and other defects that can be caused by hydrogen bubbles on the surface of the workpiece. For all material substrates with a hardness of Rockwell C40 or higher, stress-relief heat treatment is required to minimize hydrogen embrittlement of the base material.
We have two advanced x-ray fluorescence systems in-house, which enables us to test platings during and after processing and allows us to provide immediate validation of coating thickness post-treatment.
Test coupons provided for quality testing must be of the same material and stock as the workpiece s to ensure that the specification is met. Adhesion Testing We provide adhesion testing to ensure that your electroless nickel plating meets your required specifications.
Adhesion test results are recorded by ENS Technology and kept on file at our facility for seven 7 years. Request a quote on the coating s you need, or contact us to discuss your project. Get in Touch.
AMS-C-26074 and MIL-C-26074 – An explanation of the revision path
This iframe contains the logic required to handle Ajax powered Gravity Forms. The electroless nickel plating process occurs from a chemical reduction of the nickel ions within the electroless nickel solution onto a metallic substrate rather than deposition of the ions from an applied current. As a result, the electroless nickel deposit is free of many of the problems associated with traditional electrolytic nickel including edge buildup and non-uniform coating. Electroless nickel deposits are extremely uniform, corrosion and erosion resistant and provide excellent lubricity.
MIL-C-26074 E Electroless Nickel Plating
Electroless Nickel is a high quality engineering coating for corrosion resistance, hardness, lubricity, solderability and wear resistance. The advantage that Electroless Nickel has over almost all other plated coatings is the uniformity of the nickel deposit thickness. Without the high and low current density found in electrolytic plating processes, Electroless nickel can deposit into recesses without burning or having excessive thickness on the outer edges of a part. The coating conforms exactly to the surface finish of the part so cosmetic finishes will be enhanced by the Electroless Nickel deposit.